Allocate committed to providing high quality electronic components. With our experienced inspectors, advanced laboratory equipment and a team of purchasing experts, we have developed a zero-tolerance quality control process that eliminates the risk of sailing on the open market. Our inspection laboratory has the most complete and advanced facilities, and the security inspection operation is arried out by Allocate technicians who have been trained in anti-counterfeiting according to the standard process. Tests include reel-to-reel XRF testing, baking, decapsulation and high resolution magnification analysis, with destructive, non-destructive and custom testing solutions to meet the highest standards of testing and inspection.
Quality laborator
Digital Microscope – High Resolution Magnification; RoHS XRF Analyzer; Component Decapsulation; X-Ray Machine; Oven – Moisture Control; In-House Tape and Reel Services; Solderability Test System; Dynasolve Surface Analysis.
Inspection and Testing
The parts in Allocate warehouses undergo a rigorous multi-step ISO-based process to ensure the highest level of quality control. Our product assessment process meticulously documents all inspections, tests, and findings, which are stored in our comprehensive database along with corresponding images, test reports, and notes.In the event of any non-conformity being identified, our warehouse, purchasing department, and company management promptly convene a meeting to conduct an in-depth analysis of its root cause. This proactive approach aims to mitigate potential losses for the company and prevent the recurrence of similar ncidents. Typically, our trained technicians issue all POs from the company using the following common format.
Visual inspection
(external packaging, bar codes, labels, etc.)
↓Review part documents
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Internal packaging
↓
Microscopic inspection
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X-Ray
↓
Surface analysis
↓
Verification of moisture barrier protection.
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Digital images of all packaging and products documented
↓
Approval
How we do
Visual Inspection
Validate the external dimensions, markings, leads, packaging, and other characteristics:
Digital Microscopy
Detection: sanding, oxidation, retinning, and blacktopping.
Digital Imagery
Allocate's high-definition microscope effectively eliminates any occurrence of delay, distortion, or interference phenomena.
Dimensional Measurement
Integrated 2D/3D measurement system and exceptional depth of field, capture full focus on any area.
Nondestructive Testing
The field of nondestructive testing includes a range of proven techniques for testing and inspecting parts without compromising their performance or reliability. These methods are employed to detect any marks, voids, or other anomalies present on or within the parts.
X-ray
X-ray images are compared with OEM parts and are used to confirm leads and bonding lines, verifying that no voidings have formed.
XRF
The XRF Machine Measuring Coating Systems are utilized for the determination of coating thickness and composition, as well as the analysis of material content in small structures and parts.
C-SAM
The C-SAM acoustic microscope utilizes pulse-echo imaging technique to detect cracks, voids and delamination within the blacktop, thereby revealing underlying markers..
Curve Tracer
The curve tracer performs reliability analysis system, mainly verifies electrical continuity and pins, and conduct anomaly characteristic.
Destructive Testing
The use of destructive testing is considered as a last resort in cases where authentication becomes challenging, involving invasive measures such as decapsulation and lead solderability to confirm the legitimacy of a product.
Decapsulation
Decapsulation is used to verify die size and manufacturers’ logos, inspect the architecture of the die, and confirm part numbers.
Heated Solvent
The Heated-solvent testing reveals indications of counterfeiting through the detecting of sand marks, variations in texture, and the presence of blackening.
Solderability
To verifiy parts usability, we need to verify the solderability of the component leads to determine the durability of the coatings and check for signs of corrosion and oxidation in aged products.
Bond Shear
The bond strength and distribution should be measured, and the integrity of materials used for connecting passive components to molds or surface mounts should be tested in order to determine if the bond strength requirements are met.
Third party inspection:
WHITE HORSE
CECC LAB
FOXCONN
Allocate can provide third-party laboratory anti-counterfeiting test report for new customers free of charge upon request.